The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Mar. 18, 2013
Applicants:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Stmicroelectronics Pte Ltd, Singapore, SG;

Inventors:

Romain Coffy, Saint Martin le Vinoux, FR;

Eric Saugier, Villard Bonnot, FR;

Hk Looi, Singapore, SG;

Norbert Chevrier, Fontaine, FR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); G01S 17/02 (2006.01); H01L 25/16 (2006.01); H03K 17/94 (2006.01); G01S 7/481 (2006.01); H03K 17/945 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); G01S 7/481 (2013.01); G01S 17/026 (2013.01); H01L 25/167 (2013.01); H01L 31/18 (2013.01); H03K 17/941 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01); H03K 2017/9455 (2013.01); H03K 2217/94026 (2013.01); H03K 2217/94112 (2013.01);
Abstract

An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.


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