The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

May. 21, 2014
Applicant:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventor:

BoXiu Cai, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06T 7/00 (2006.01); H01J 37/22 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06F 17/5081 (2013.01); H01J 37/222 (2013.01); H01J 37/28 (2013.01); G06T 2207/30148 (2013.01); H01J 2237/226 (2013.01); H01J 2237/2817 (2013.01);
Abstract

A method may be implemented for obtaining calibration data for use in calibrating an optical proximity correction model. The method may include capturing an image for each portion of a plurality of portions of a wafer to obtain captured images. The method may further include assembling at least portions of the captured images to form an assembled image. The method may further include mapping layout data of the wafer with the assembled image. The method may further include selecting portions of the assembled image based on the layout data of the wafer. The method may further include obtaining data associated with the portions of the assembled image as the calibration data.


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