The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Dec. 08, 2010
Applicants:

Hsiao-tsung Yen, Tainan, TW;

Yu-ling Lin, Taipei, TW;

Chin-wei Kuo, Zhubei, TW;

Ho-hsiang Chen, Hsinchu, TW;

Sa-lly Liu, Hsinchu, TW;

Inventors:

Hsiao-Tsung Yen, Tainan, TW;

Yu-Ling Lin, Taipei, TW;

Chin-Wei Kuo, Zhubei, TW;

Ho-Hsiang Chen, Hsinchu, TW;

Sa-Lly Liu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 31/3185 (2006.01); G11C 29/56 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01R 31/318511 (2013.01); G11C 29/56 (2013.01); H01L 22/34 (2013.01); G11C 2029/5602 (2013.01);
Abstract

A transmission line is provided. In one embodiment, the transmission line comprises a substrate, a well within the substrate, a shielding layer over the well, and a plurality of intermediate metal layers over the shielding layer, the plurality of intermediate metal layers coupled by a plurality of vias. The transmission line further includes a top metal layer over the plurality of intermediate metal layers. A test structure for de-embedding an on-wafer device, and a wafer are also disclosed.


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