The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Sep. 21, 2012
Hitachi Chemical Company, Ltd., Tokyo, JP;
Masahiro Aoshima, Ibaraki, JP;
Yoshihiro Takahashi, Ibaraki, JP;
Yuka Yamazaki, Saitama, JP;
Yasuo Kamigata, Ibaraki, JP;
Hikari Murai, Ibaraki, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer includes a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer includes a cured product of the resin composition. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate including a cured resin layer forming step of forming the cured resin layer on the surface of a glass substrate.