The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
May. 31, 2012
Bonnie I. Wang, Cupertino, CA (US);
Chiakang Sung, Milpitas, CA (US);
Joseph Huang, Morgan Hill, CA (US);
Khai Nguyen, San Jose, CA (US);
Tony Ngai, Saratoga, CA (US);
Zhe LI, San Jose, CA (US);
Hong Shi, Fremont, CA (US);
Bonnie I. Wang, Cupertino, CA (US);
Chiakang Sung, Milpitas, CA (US);
Joseph Huang, Morgan Hill, CA (US);
Khai Nguyen, San Jose, CA (US);
Tony Ngai, Saratoga, CA (US);
Zhe Li, San Jose, CA (US);
Hong Shi, Fremont, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
An integrated circuit in a multi-chip package is provided. The integrated circuit may include adjustable interface circuitry configured to interface with other off-chip components. In particular, the adjustable interface circuitry may include a microbump input-output buffer operable to drive signals off of the integrated circuit and operable to receive signals from other integrated circuits in the multi-chip package via a microbump. The microbump input-output buffer may include output buffers and input buffers. The output buffers may have programmable drive strengths and may each be selectively switched in and out of use depending on the desired application. Each output buffer may include a level shifter, a buffer circuit, and multiple inverter-like circuits each of which can be turned on or off to adjust the drive strength of that output buffer.