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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9099541 B1

PDFFull Text
Date of Patent:
Aug. 04, 2015

Filed:

Jan. 31, 2014

Method of manufacturing semiconductor device

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Ji Hwang Kim, Bucheon-si, KR;

Sunpil Youn, Seoul, KR;

Sangwon Kim, Seoul, KR;

Kwang-chul Choi, Suwon-si, KR;

Tae Hong Min, Gumi-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Colleen A Matthews

Assistant Examiner:

William Harriston

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/36 (2013.01); H01L 23/481 (2013.01); H01L 21/768 (2013.01); H01L 23/49816 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A semiconductor device includes a substrate having a first side and a second side such that the first and second sides face each other, a through via plug penetrating the substrate, an insulating film liner, and an antipollution film. The insulating film liner is between the through via plug and the substrate and the insulating film liner has a recessed surface with respect to the second side. The antipollution film covers the second side and the antipollution film is on the recessed surface and between the through via plug and the substrate.

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