The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Feb. 04, 2005
Applicants:

Claus Harder, Uttenreuth, DE;

Roland Rohde, Burgdorf, DE;

Erhard Flach, Berlin, DE;

Wolfgang Geistert, Rheinfelden, DE;

Gernot Kolberg, Berlin, DE;

Heinz Müller, Erlangen, DE;

Eva Heublein, Coburg, DE;

Nora Heublein, Cologne, DE;

Christoph Heublein, Hannover, DE;

Inventors:

Claus Harder, Uttenreuth, DE;

Roland Rohde, Burgdorf, DE;

Bernd Heublein, Hannover, DE;

Erhard Flach, Berlin, DE;

Wolfgang Geistert, Rheinfelden, DE;

Gernot Kolberg, Berlin, DE;

Heinz Müller, Erlangen, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61M 31/00 (2006.01); A61L 31/02 (2006.01); A61L 31/08 (2006.01); A61L 31/14 (2006.01); A61L 31/16 (2006.01); A61F 2/86 (2013.01);
U.S. Cl.
CPC ...
A61L 31/022 (2013.01); A61L 31/08 (2013.01); A61L 31/148 (2013.01); A61L 31/16 (2013.01); A61F 2/86 (2013.01); A61F 2210/0004 (2013.01); A61F 2250/0068 (2013.01); A61L 2300/604 (2013.01);
Abstract

An implant for releasing an active substance into a vessel through which a body medium flows. The implant release an active substance into a vessel through which a body medium flows downstream from the location of the implant. A base of a biodegradable material is a carrier of the active substance to be released. The body medium flows past the implant and the active substance is release. The implant is configured so that the active substance does not contact a vessel wall at the location of implant.

Published as:
DE102004029611A1; CN1905913A; JP2007520292A; US2009182290A1; CN1905913B; JP4769730B2; US9095642B2;

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