The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

May. 15, 2013
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hidenori Koshikawa, Annaka, JP;

Mikio Shiono, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/08 (2006.01); H01L 33/56 (2010.01); C09J 183/04 (2006.01); C08L 71/02 (2006.01); C08L 83/04 (2006.01); H01L 23/29 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08G 77/24 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08L 71/02 (2013.01); C08L 83/04 (2013.01); C09J 183/04 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/24 (2013.01); H01L 23/296 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The curable composition for encapsulating an optical semiconductor includes, a linear polyfluoro compound, a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, a platinum group metal catalyst, a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by HS K6253-3. The present invention provides a curable composition for encapsulating an optical semiconductor which gives a cured product excellent in impact resistance and adhesiveness, and an optical semiconductor apparatus in which an optical semiconductor device is encapsulated by a cured product obtained by curing the curable composition for encapsulating an optical semiconductor.


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