The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Sep. 26, 2012
Applicants:

Jean-philippe Noel, Grenoble, FR;

Bastien Giraud, Sanary sur Mer, FR;

Olivier Thomas, Revel, FR;

Inventors:

Jean-Philippe Noel, Grenoble, FR;

Bastien Giraud, Sanary sur Mer, FR;

Olivier Thomas, Revel, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 21/768 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 27/092 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 21/768 (2013.01); H01L 21/84 (2013.01); H01L 27/1203 (2013.01); H01L 29/78609 (2013.01); H01L 29/78648 (2013.01); H01L 21/823892 (2013.01); H01L 27/0928 (2013.01);
Abstract

A manufacture includes an IC comprising a stacking of a semiconducting substrate, a buried insulating layer, and a semiconducting layer, a first electronic component formed in and/or on the semiconductor layer, a bias circuit to generate a first bias voltage, first and second via-type interconnections, to which the bias circuit applies a same bias voltage equal to the first bias voltage, a first insulation trench separating the first electronic component from the first and second interconnections, a first ground plane having a first type of doping, placed beneath the buried insulating layer plumb with the first electronic component, and extending beneath the first insulation trench and up into contact the first interconnection, and a first well having a second type of doping opposite that of the first type, plumb with the first ground plane, and extending beneath the first insulation trench and up into contact with the second interconnection.


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