The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Aug. 08, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming-Hui Yang, New Taipei, TW;

Hsin Wei Chiu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/02 (2006.01); H01L 23/10 (2006.01); H01L 23/522 (2006.01); H01L 23/58 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4814 (2013.01); H01L 23/5225 (2013.01); H01L 23/58 (2013.01); H01L 23/585 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A double seal ring for an integrated circuit, the double seal ring includes a first seal ring surrounding the integrated circuit and a second seal ring spaced from the first seal ring. The double seal ring further includes two connectors connecting the first seal ring and the second seal ring, wherein the first seal ring, the second seal ring, and the two connectors form a closed loop. A method of forming a double seal ring for an integrated circuit includes forming a first seal ring surrounding the integrated circuit and forming a second seal ring spaced from the first seal ring. The method further includes forming two connectors connecting the first seal ring and the second seal ring, wherein the first seal ring, the second seal ring, and the two connectors form a closed loop.


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