The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Sep. 27, 2013
Applicants:

Hengpeng Wu, Hillsborough, NJ (US);

Jian Yin, Bridgewater, NJ (US);

Guanyang Lin, Whitehouse Station, NJ (US);

Jihoon Kim, North Wales, PA (US);

Jianhui Shan, Pennington, NJ (US);

Inventors:

Hengpeng Wu, Hillsborough, NJ (US);

Jian Yin, Bridgewater, NJ (US);

Guanyang Lin, Whitehouse Station, NJ (US);

JiHoon Kim, North Wales, PA (US);

Jianhui Shan, Pennington, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C03C 15/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02118 (2013.01); H01L 21/02282 (2013.01);
Abstract

Disclosed herein is a formulation for depositing a cured underlayer for promoting the formation of self assembled structures. The underlayer comprises: (a) a polymer comprising at least one pendant vinyl ether monomer repeat unit having the structure, (I): wherein R is chosen from H, C-Calkyl, or halogen, and W is a divalent group chosen from C-Calkylene, C-Carylene, benzylene, or C-Calkyleneoxyalkylene; (ii) optional thermal acid generator; and (c) a solvent. The invention also relates to processes of forming a pattern using the underlayer.


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