The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

May. 16, 2012
Applicants:

Kunihiko Suzuki, Shizuoka-ken, JP;

Hironobu Hirata, Mishima, JP;

Inventors:

Kunihiko Suzuki, Shizuoka-ken, JP;

Hironobu Hirata, Mishima, JP;

Assignee:

NuFlare Technology, Inc., Shizuoka-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C30B 25/10 (2006.01); C30B 25/12 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01);
U.S. Cl.
CPC ...
C30B 25/10 (2013.01); C23C 16/4584 (2013.01); C23C 16/4586 (2013.01); C23C 16/46 (2013.01); C30B 25/12 (2013.01);
Abstract

An apparatus for manufacturing a semiconductor device includes an out-heater including a heater element formed in an annular shape with a disconnected portion at one place, a first electrode component connected to a first heater electrode part of the heater element, a second electrode component connected to a second heater electrode part of the heater element, and a base including a first groove in which the first electrode component is fixedly disposed, and a second groove in which the second electrode component is movably disposed and a groove width in a circumferential direction of the heater element is formed such that a width of a second gap formed between a side of the second electrode component and an inner wall of the groove is wider than a width of a first gap formed between a side of the first electrode component and an inner wall of the first groove.


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