The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Nov. 07, 2011
Toshio Shinoda, Kiyosu, JP;
Kayoko Nagahara, Kiyosu, JP;
Yutaka Inoue, Kiyosu, JP;
Shuhei Takahashi, Kiyosu, JP;
Toshihiro Miwa, Kiyosu, JP;
Toshio Shinoda, Kiyosu, JP;
Kayoko Nagahara, Kiyosu, JP;
Yutaka Inoue, Kiyosu, JP;
Shuhei Takahashi, Kiyosu, JP;
Toshihiro Miwa, Kiyosu, JP;
FUJIMI INCORPORATED, Kiyosu-shi, JP;
Abstract
Provided is a polishing composition containing abrasive grains, at least one type of alcohol compound selected from the group consisting of aliphatic alcohols with 2 to 6 carbon atoms and glycol ethers with 3 to 10 carbon atoms, at least one type of basic compound selected from the group consisting of quaternary ammonium salts and alkali metal salts, and water. The average primary particle diameter of the abrasive grains is 5 to 50 nm. The content of the alcohol compound in the polishing composition is 0.01 to 1% by mass. The polishing composition is mainly used in an application of polishing a semiconductor substrate surface.