The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Jan. 21, 2013
Applicant:
Atotech Deutschland Gmbh, Berlin, DE;
Inventor:
Boris Alexander Janssen, Berlin, DE;
Assignee:
Atotech Deutschland GmbH, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 1/09 (2006.01); C23C 18/16 (2006.01); C23C 18/36 (2006.01); H05K 3/24 (2006.01); C23C 18/50 (2006.01); H05K 1/02 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C23C 18/16 (2013.01); C23C 18/1633 (2013.01); C23C 18/36 (2013.01); C23C 18/50 (2013.01); H05K 1/028 (2013.01); H05K 3/22 (2013.01); H05K 3/244 (2013.01); B05D 5/12 (2013.01); H05K 2201/032 (2013.01);
Abstract
The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.