The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Mar. 29, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Shawn A. Adderly, Essex Junction, VT (US);

Daniel A. Delibac, Colchester, VT (US);

Zhong-Xiang He, Essex Junction, VT (US);

Matthew D. Moon, Jeffersonville, VT (US);

Anthony C. Speranza, Georgetown, TX (US);

Timothy D. Sullivan, Underhill, VT (US);

David C. Thomas, Richmond, VT (US);

Eric J. White, Charlotte, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 23/53223 (2013.01); H01L 28/60 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Disclosed are semiconductor structures with metal lines and methods of manufacture which reduce or eliminate extrusion formation. The method includes forming a metal wiring comprising a layered structure of metal materials with an upper constraining layer. The method further includes forming a film on the metal wiring which prevents metal extrusion during an annealing process.


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