The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
May. 13, 2013
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Akinobu Inoue, Nagano, JP;
Haruo Sorimachi, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, JP;
Abstract
A semiconductor device includes a wiring substrate, a semiconductor chip whose connection terminal is connected to the wiring substrate, an underfill resin formed from a clearance between the wiring substrate and the semiconductor chip to a periphery area of the semiconductor chip, wherein the underfill resin in the periphery area is formed at a same height as an upper surface of the semiconductor chip, an auxiliary member fixed on the semiconductor chip by an adhesive layer, and including a protruding portion which protrudes to an outside from the semiconductor chip, and the protruding portion arranged at least on the underfill resin via the adhesive layer, and a sealing resin sealing the underfill resin and at least side faces of the auxiliary member, wherein respective coefficients of thermal expansion of the auxiliary member and the adhesive layer are larger than a coefficient of thermal expansion of the semiconductor chip.