The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Mar. 30, 2010
Applicants:

Takahiko Wada, Tokyo, JP;

Takuma Hirayama, Tokyo, JP;

Inventors:

Takahiko Wada, Tokyo, JP;

Takuma Hirayama, Tokyo, JP;

Assignee:

SAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G01R 31/04 (2006.01); H05K 13/08 (2006.01); G06T 7/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 13/08 (2013.01); G01R 31/048 (2013.01); G06T 7/0004 (2013.01); H05K 3/3436 (2013.01); H05K 2203/163 (2013.01);
Abstract

A substrate surface detection unit performs image analysis of cross-sectional images of an object to be inspected including a substrate and an electronic component and specifies a surface image on which the surface of the substrate is photographed. A pseudo cross-sectional image creation unit specifies a region of the solder for joining the substrate and the electronic component, the solder being photographed on the cross-sectional images, and creates a pseudo cross-sectional image in which an imaged region is made to have a thickness in a pseudo manner by piling up the cross-sectional images on which the solder is photographed. An inspection unit estimates whether the joint state of the solder is good or bad by performing image analysis on the region of the solder photographed on the surface image and the pseudo cross-sectional image.


Find Patent Forward Citations

Loading…