The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Mar. 19, 2012
Applicants:

Tsung-yuan Chen, Taoyuan County, TW;

Chun-chien Chen, Taipei County, TW;

Cheng-po Yu, Taoyuan County, TW;

Inventors:

Tsung-Yuan Chen, Taoyuan County, TW;

Chun-Chien Chen, Taipei County, TW;

Cheng-Po Yu, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/00 (2006.01); H05K 3/36 (2006.01); H05K 1/00 (2006.01); H05K 1/14 (2006.01); H05K 3/42 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 3/428 (2013.01); H05K 3/0032 (2013.01); H05K 3/0038 (2013.01); H05K 3/0035 (2013.01); H05K 3/20 (2013.01); H05K 3/205 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/0369 (2013.01); H05K 2203/0376 (2013.01); H05K 2203/0384 (2013.01); H05K 2203/0554 (2013.01); H05K 2203/108 (2013.01); H05K 2203/1476 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49126 (2015.01);
Abstract

A process for fabricating a wiring board is provided. In the process, a wiring carrying substrate including a carry substrate and a wiring layer is formed. Next, at least one blind via is formed in the wiring carrying substrate. Next, the wiring carrying substrate is laminated to another wiring carrying substrate via an insulation layer. The insulation layer is disposed between the wiring layers of the wiring carrying substrates and full fills the blind via. Next, parts of the carry substrates are removed to expose the insulation layer in the blind via. Next, a conductive pillar connected between the wiring layers is formed. Next, the rest carry substrates are removed.


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