The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Mar. 18, 2013
Unimicron Technology Corp., Taoyuan, TW;
Chen-Chuan Chang, Taoyuan County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A manufacturing method of a circuit board is provided. Providing a substrate, where a first laser resistant structure is disposed on a first dielectric layer and at the periphery of a pre-removing area, a second dielectric layer covers the first laser resistant structure, a circuit layer is disposed on the second dielectric layer, a second laser resistant structure is disposed on the second dielectric layer and at the periphery of the pre-removing area, a third dielectric layer covers the circuit layer and the second laser resistant structure. There are gaps between the second laser resistant structure and the circuit layer, and the vertical projection of the gaps on the first dielectric layer overlaps the first laser resistant structure. A laser machining process is performed to etch the third dielectric layer at the periphery of the pre-removing area. The portion of the third dielectric layer within the pre-removing area is removed.