The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Jan. 18, 2012
Tomohiko Kotake, Ibaraki, JP;
Masato Miyatake, Ibaraki, JP;
Shunsuke Nagai, Ibaraki, JP;
Hiroyuki Izumi, Ibaraki, JP;
Shinji Tsuchikawa, Ibaraki, JP;
Shin Takanezawa, Ibaraki, JP;
Hikari Murai, Ibaraki, JP;
Tomohiko Kotake, Ibaraki, JP;
Masato Miyatake, Ibaraki, JP;
Shunsuke Nagai, Ibaraki, JP;
Hiroyuki Izumi, Ibaraki, JP;
Shinji Tsuchikawa, Ibaraki, JP;
Shin Takanezawa, Ibaraki, JP;
Hikari Murai, Ibaraki, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.