The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Sep. 25, 2014
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Byung Mok Kim, Seoul, KR;
Bo Hee Kang, Seoul, KR;
Ha Na Kim, Seoul, KR;
Hiroshi Kodaira, Seoul, KR;
Yuichiro Tanda, Seoul, KR;
Satoshi Ozeki, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); A61L 2/08 (2006.01); F21V 31/00 (2006.01); H01L 33/62 (2010.01); A61L 2/10 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/641 (2013.01); A61L 2/08 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15174 (2013.01); A61L 2/10 (2013.01);
Abstract
A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.