The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
May. 09, 2012
Applicant:
Chin-hsien Chen, New Taipei, TW;
Inventor:
Chin-Hsien Chen, New Taipei, TW;
Assignee:
Foxconn Technology Co., Ltd., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H05K 7/00 (2006.01); H01L 23/467 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01); G06F 1/20 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/467 (2013.01); H01L 23/367 (2013.01); H01L 23/4093 (2013.01); H01L 23/427 (2013.01); F28D 15/0275 (2013.01); G06F 1/20 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.