The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Aug. 28, 2009
Applicants:
Kazuhiko Kurafuchi, Tsukuba, JP;
Toshizumi Yoshino, Kamisu, JP;
Hideyuki Katagi, Tsukuba, JP;
Masaya Ookawa, Kamisu, JP;
Yoshiaki Fuse, Kamisu, JP;
Inventors:
Kazuhiko Kurafuchi, Tsukuba, JP;
Toshizumi Yoshino, Kamisu, JP;
Hideyuki Katagi, Tsukuba, JP;
Masaya Ookawa, Kamisu, JP;
Yoshiaki Fuse, Kamisu, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/028 (2006.01); G03F 7/038 (2006.01); G03F 7/004 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0388 (2013.01); G03F 7/0047 (2013.01); H05K 3/287 (2013.01); G03F 7/0385 (2013.01);
Abstract
The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.