The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Apr. 27, 2010
Masanao Fukuda, Toyama, JP;
Kenji Shirako, Toyama, JP;
Akihiro Sato, Toyama, JP;
Kazuhiro Morimitsu, Toyama, JP;
Sadao Nakashima, Toyama, JP;
Masanao Fukuda, Toyama, JP;
Kenji Shirako, Toyama, JP;
Akihiro Sato, Toyama, JP;
Kazuhiro Morimitsu, Toyama, JP;
Sadao Nakashima, Toyama, JP;
HITACHI KOKUSAI ELECTRIC, INC., Tokyo, JP;
Abstract
Provided is a heat treatment apparatus that can form films having a uniform thickness on a plurality of substrates. The heat treatment apparatus comprises a process chamber configured to grow silicon carbide (SiC) films on wafers, a boat configured to hold a plurality of wafers in a state where the wafers are vertically arranged and approximately horizontally oriented so as to hold the wafers in the process chamber, a heating unit installed in the process chamber, and a gas supply nozzle configured to supply a reaction gas. The heating unit comprises a susceptor configured to cover at least a part of the boat, and a susceptor wall disposed between the boat and the susceptor.