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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9074118 B1

PDFFull Text
Date of Patent:
Jul. 07, 2015

Filed:

Jul. 06, 2007

Cmp method for metal-containing substrates

Applicants:

Robert Vacassy, Aurora, IL (US);

Renjie Zhou, Brookfield, CT (US);

Inventors:

Robert Vacassy, Aurora, IL (US);

Renjie Zhou, Brookfield, CT (US);

Assignee:

Cabot Microelectronics Corporation, Aurora, IL (US);

Attorneys:

Thomas E Omholt

Arlene Hornilla

Primary Examiner:

Binh X Tran

Assistant Examiner:

Thomas Pham

Int. Cl.
CPC ...
H01L 21/302 (2006.01); B44C 1/22 (2006.01); C23F 1/00 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C09K 13/00 (2006.01); C09K 3/14 (2006.01); C09G 1/02 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1436 (2013.01); C09G 1/02 (2013.01); H01L 21/3212 (2013.01);
Abstract

An aqueous chemical-mechanical polishing composition for polishing metal containing substrates comprising an abrasive particle consisting essentially of a primary particle modified with an aluminosilicate layer, and wherein the abrasive particle has a zeta potential measured at pH 2.3 of about −5 mV to about −100 mV. The composition can be used to polish the surface of a tungsten containing substrate.

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Vacassy, Robert. (2015). Cmp method for metal-containing substrates (U.S. Patent No. 9074118). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9074118

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