The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
May. 30, 2013
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Buu Diep, Murphy, TX (US);
Roland Gooch, Dallas, TX (US);
Assignee:
RAYTHEON COMPANY, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/02 (2006.01); B32B 38/10 (2006.01); B32B 37/30 (2006.01); B81C 3/00 (2006.01); B32B 37/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/30 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1374 (2015.01); Y10T 156/12 (2015.01); Y10T 156/1052 (2015.01); Y10T 156/108 (2015.01); Y10T 156/1062 (2015.01); B32B 37/02 (2013.01); B81C 3/007 (2013.01); B32B 38/10 (2013.01); B81C 3/008 (2013.01); B32B 37/0076 (2013.01); B81C 2203/035 (2013.01); B81C 1/00269 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/032 (2013.01);
Abstract
In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.