The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Aug. 24, 2012
Shinichiro Takatani, Tao Yuan Shien, TW;
Hsien-fu Hsiao, Tao Yuan Shien, TW;
Yu-kai Wu, Tao Yuan Shien, TW;
Shinichiro Takatani, Tao Yuan Shien, TW;
Hsien-Fu Hsiao, Tao Yuan Shien, TW;
Yu-Kai Wu, Tao Yuan Shien, TW;
WIN SEMICONDUCTORS CORP., Kuei Shan Hsiang, Tao Yuan Shien, TW;
Abstract
A compound semiconductor integrated circuit is provided, comprising a substrate, at least one compound semiconductor electronic device, a first metal layer, a protection layer, a plurality of second metal layers, and at least one dielectric layer. The first metal layer contains Au but does not contain Cu, and is at least partly electrically connected to the compound semiconductor electronic device. The protection layer covers the compound semiconductor electronic device and at least part of the first metal layer. Each of the plurality of second metal layers contains at least a Cu layer, and at least one of the plurality of second metal layers is partly electrically connected to the first metal layer described above. The at least one dielectric layer separates each pair of adjacent second metal layers. The second metal layers are used to form passive electronic components.