The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

May. 15, 2009
Applicants:

David Malcolm Camm, Vancouver, CA;

Joseph Cibere, Burnaby, CA;

Greg Stuart, Burnaby, CA;

Steve Mccoy, Burnaby, CA;

Inventors:

David Malcolm Camm, Vancouver, CA;

Joseph Cibere, Burnaby, CA;

Greg Stuart, Burnaby, CA;

Steve McCoy, Burnaby, CA;

Assignee:

Mattson Technology, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); C21D 11/00 (2006.01); H01L 21/67 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); C21D 11/00 (2013.01); H01L 21/324 (2013.01); H01L 21/67098 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01); H01L 21/67253 (2013.01); H01L 22/26 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Methods and apparatus for heat-treating a workpiece are disclosed. An illustrative method includes measuring deformation of a workpiece during heat-treating thereof, and taking an action in relation to the heat-treating of the workpiece, in response to the measuring of the deformation of the workpiece. The workpiece may include a semiconductor wafer. Taking an action may include applying a deformation correction to a temperature or reflectivity measurement of the wafer during thermal processing, or may include modifying the heat-treating of the wafer, for example.


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