The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Aug. 04, 2014
Applicants:
Ho-cheol Lee, Yongin-si, KR;
Chi-sung OH, Gunpo-si, KR;
Jin-kuk Kim, Hwaseong-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 27/02 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G11C 5/025 (2013.01); G11C 5/06 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 22/32 (2013.01); H01L 24/09 (2013.01); H01L 27/0255 (2013.01); H01L 27/108 (2013.01); H01L 2224/0912 (2013.01); H01L 2224/09179 (2013.01); H01L 2224/09515 (2013.01); H01L 2225/06541 (2013.01);
Abstract
A semiconductor memory device includes a semiconductor die and an input-output bump pad part. The semiconductor die includes a plurality of memory cell arrays. The input-output bump pad part is formed in a central region of the semiconductor die. The input-output bump pad part provides a plurality of channels for connecting each of the memory cell arrays independently to an external device. The semiconductor memory device may adopt the multi-channel interface, thereby having high performance with relatively low power consumption.