The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

May. 04, 2012
Applicants:

Chih-hong Hwang, New Taipei, TW;

Chun-lin Chang, Jhubei, TW;

Nai-han Cheng, Hsinchu, TW;

Chi-ming Yang, Hsinchu, TW;

Chin-hsiang Lin, Hsin-Chu, TW;

Inventors:

Chih-Hong Hwang, New Taipei, TW;

Chun-Lin Chang, Jhubei, TW;

Nai-Han Cheng, Hsinchu, TW;

Chi-Ming Yang, Hsinchu, TW;

Chin-Hsiang Lin, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/317 (2006.01); H01J 37/147 (2006.01); H01J 37/08 (2006.01); H01J 37/30 (2006.01); H01L 21/265 (2006.01); H01L 21/67 (2006.01); H01J 37/302 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3023 (2013.01); H01J 37/3171 (2013.01); H01L 21/68764 (2013.01); H01J 2237/30483 (2013.01); H01L 21/265 (2013.01); H01J 37/3172 (2013.01); H01J 2237/30477 (2013.01); H01J 2237/12 (2013.01);
Abstract

A process control method is provided for ion implantation methods and apparatuses, to produce a high dosage area on a substrate such as may compensate for noted non-uniformities. In an ion implantation tool, separately controllable electrodes are provided as multiple sets of opposed electrodes disposed outside an ion beam. Beam blockers are positionable into the ion beam. Both the electrodes and beam blockers are controllable to reduce the area of the ion beam that is incident upon a substrate. The electrodes and beam blockers also change the position of the reduced-area ion beam incident upon the surface. The speed at which the substrate scans past the ion beam may be dynamically changed during the implantation process to produce various dosage concentrations in the substrate.


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