The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Jun. 30, 2012
Applicants:

Todd P. Albertson, Warren, OR (US);

Michael T. Crocker, Portland, OR (US);

David Shia, Portland, OR (US);

Lothar R. Kress, Portland, OR (US);

Inventors:

Todd P. Albertson, Warren, OR (US);

Michael T. Crocker, Portland, OR (US);

David Shia, Portland, OR (US);

Lothar R. Kress, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 1/073 (2006.01); G01R 3/00 (2006.01); G01R 31/28 (2006.01); G01R 1/00 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07378 (2013.01); Y10T 29/49144 (2015.01); Y10T 29/4913 (2015.01); G01R 1/00 (2013.01); H01L 21/00 (2013.01); G01R 3/00 (2013.01); G01R 31/2889 (2013.01); G01R 1/07357 (2013.01);
Abstract

A wire probe assembly and forming process is described. In one example, a method includes inserting a plurality of wires through a probe former and a tip retainer to contact a probe head substrate, attaching the wires to a surface of the substrate, pulling the probe former laterally with respect to the substrate surface and the tip retainer to bend the wires into test probes with a resiliency to transverse movement, and removing the tip retainer to form a test probe head.


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