The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Mar. 29, 2013
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventors:
Makoto Terui, Ogaki, JP;
Daiki Komatsu, Ogaki, JP;
Masatoshi Kunieda, Ogaki, JP;
Takashi Kariya, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 3/10 (2013.01); Y10T 29/49165 (2015.01); H05K 3/4602 (2013.01); H05K 3/4658 (2013.01); H05K 3/4694 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/1053 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 21/563 (2013.01); H01L 23/5382 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15192 (2013.01);
Abstract
A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer.