The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Apr. 01, 2013
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Jake Joo, Cambridge, MA (US);

Jerome Claracq, Oostakker, BE;

Sylvie Vervoort, Ghent, BE;

Mubasher Bashir, Terneuzen, NL;

Peter Trefonas, Medway, MA (US);

Garo Khanarian, Princeton, NJ (US);

Kathleen O'Connell, Cumberland, RI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 25/68 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 9/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H05K 3/0079 (2013.01); H05K 3/061 (2013.01); H05K 3/067 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0278 (2013.01); H05K 9/0084 (2013.01);
Abstract

Method of manufacturing patterned conductor is provided, comprising: providing a conductivized substrate, wherein the conductivized substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of masking fibers onto the electrically conductive layer; exposing the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the plurality of masking fibers is removed from the substrate, leaving an interconnected conductive network on the substrate covered by the plurality of masking fibers; and, exposing the plurality of masking fibers to the masking fiber solvent, wherein the plurality of masking fibers are removed to uncover the interconnected conductive network on the substrate.


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