The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Aug. 23, 2013
Applicants:

Fukui Precision Component (Shenzhen) Co., Ltd., Shenzhen, CN;

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Inventors:

Rui-Wu Liu, Shenzhen, CN;

Yu-Hsien Lee, New Taipei, TW;

Wen-Hsin Yu, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/36 (2006.01); H05K 3/20 (2006.01); H05K 1/00 (2006.01); H05K 1/09 (2006.01); B05D 3/00 (2006.01); C08J 7/18 (2006.01); G21H 5/00 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/005 (2013.01); Y10T 29/49124 (2013.01); H05K 3/0032 (2013.01); H05K 3/0052 (2013.01); H05K 2201/09063 (2013.01); H05K 2203/0346 (2013.01); H05K 2203/107 (2013.01);
Abstract

A method for manufacturing a PCB includes certain steps. A printed circuit board sheet is provided. The printed circuit board includes an unwanted portion and a printed circuit board unit which includes a plurality of contact pads. An imaginary boundary line is defined between the printed circuit board unit and the unwanted portion. Each of the contact pads defines an outline. A nearest distance between the outline and the imaginary boundary line is less than 4 millimeters. The printed circuit board sheet is punched along the imaginary boundary line, forming one hollow portion or a plurality of through slots. A plurality of burrs is generated on an inner surface of the hollow portion or the through slots. The burrs are removed using a low-energy laser cutting process, thereby obtaining a printed circuit board. A laser power used in the low-energy laser cutting process is 5-8 watts.


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