The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Aug. 09, 2010
Applicants:
Chin-tien Chiu, Taichung, TW;
Shrikar Bhagath, San Jose, CA (US);
Yuang Zhang, Shanghai, CN;
LU Zhong, Shanghai, CN;
Kaiyou Qian, Shanghai, CN;
Inventors:
Chin-Tien Chiu, Taichung, TW;
Shrikar Bhagath, San Jose, CA (US);
Yuang Zhang, Shanghai, CN;
Lu Zhong, Shanghai, CN;
Kaiyou Qian, Shanghai, CN;
Assignee:
SanDisk Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/34 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/34 (2013.01); H01L 21/02024 (2013.01);
Abstract
A semiconductor wafer, die and semiconductor package formed therefrom are disclosed, where the inactive surface of the wafer has an extrinsic gettering pattern formed from a texturing process. In examples, the texturing process follows a polishing process that removes stress concentration point from the inactive surface of the wafer.