The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Sep. 06, 2012
Applicant:

Hitoshi Kondo, Nagano, JP;

Inventor:

Hitoshi Kondo, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 3/387 (2013.01); H05K 3/388 (2013.01); H05K 3/4069 (2013.01); H05K 3/205 (2013.01); H05K 3/4682 (2013.01); H05K 2201/0195 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H01L 2924/01322 (2013.01); H01L 23/49822 (2013.01); H01L 21/4857 (2013.01);
Abstract

A wiring board includes: a first wiring layer; a first insulating layer formed on the first wiring layer and including a reinforcing material therein, the first insulating layer having a first opening; a contact layer formed on the first insulating layer and having a second opening communicated with the first opening; and a second wiring layer comprising a second via and a second wiring pattern connected to the second via. The second wiring pattern is formed on the contact layer, and the second via is filled in the first and second openings. An adhesion property between the contact layer and the second wiring pattern is higher than that between the first insulating layer and the second wiring pattern, and a thickness of the contact layer is smaller than that of the first insulating layer.


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