The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Oct. 29, 2012
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Yen-Ting Kuo, Tainan, TW;

Ping-Cheng Hu, Kaohsiung, TW;

Yu-Fang Tsai, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 33/54 (2013.01); H01L 2933/0033 (2013.01);
Abstract

Light-emitting semiconductor packages and related methods. The light-emitting semiconductor package includes a central barrier, a plurality of leads, a light-emitting device, a first encapsulant, a package body, and a second encapsulant. The light-emitting device is disposed in the interior space defined by the central barrier and is electrically connected to the leads surrounding the central barrier. The light-emitting device includes upper and lower light-emitting surfaces. The first encapsulant and the second encapsulant cover the upper and lower light-emitting surfaces, respectively. The package body encapsulates portions of the central barrier, portions of each of the leads, and the first encapsulant. The light-emitting semiconductor package can emit light from both the upper and lower sides thereof.


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