The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9059203 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 16, 2015

Filed:

Sep. 25, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Toshiharu Furukawa, Essex Junction, VT (US);

Robert R. Robison, Colchester, VT (US);

Richard Q. Williams, Essex Junction, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 21/84 (2006.01); H01L 29/786 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66477 (2013.01); H01L 21/84 (2013.01); H01L 27/1203 (2013.01); H01L 29/78648 (2013.01); H01L 29/78654 (2013.01); H01L 21/02104 (2013.01);
Abstract

Disclosed is a semiconductor-on-insulator (SOI) structure (e.g., an SOI field effect transistor (FET)) and method of forming the SOI structure so as to have sub-insulator layer void(s) selectively placed so that capacitance coupling between a first section of a semiconductor layer and the substrate will be less than capacitance coupling between a second section of the semiconductor layer and the substrate. The first section may contain a first device and the second section may contain a second device. Alternatively, the first and second sections may comprise different regions of the same device. For example, in an SOI FET, sub-insulator layer voids can be selectively placed in the substrate below the source, drain and/or body contact diffusion regions, but not below the channel region so that capacitance coupling between the these various diffusion regions and the substrate will be less than capacitance coupling between the channel region and the substrate.


Find Patent Forward Citations

Furukawa, Toshiharu. (2015). Semiconductor-on-insulator (soi) structure with selectivity placed sub-insulator layer void(s) and method of forming the soi structure (U.S. Patent No. 9059203). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9059203

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