The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Mar. 14, 2013
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Henrik Ewe, Burglengenfeld, DE;

Anton Prueckl, Schierling, DE;

Joachim Mahler, Regensburg, DE;

Frank Daeche, Unterhaching, DE;

Josef Hoeglauer, Heimstetten, DE;

Riccardo Pittassi, Villach, AT;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49572 (2013.01); H01L 23/49575 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/1305 (2013.01);
Abstract

Various embodiments provide a chip package. The chip package may include a metallic chip carrier; at least one chip carried by the metallic chip carrier; encapsulation material encapsulating the at least one chip and the metallic chip carrier; and a plurality of redistribution layers disposed over the at least one chip opposite the metallic chip carrier, wherein at least one redistribution layer of the plurality of redistribution layers is electrically coupled with the at least one chip.


Find Patent Forward Citations

Loading…