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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9059143 B1

PDFFull Text
Date of Patent:
Jun. 16, 2015

Filed:

Mar. 30, 2011

Semiconductor device

Applicants:

Yukari Imaizumi, Kanagawa, JP;

Goshi Kawazu, Kanagawa, JP;

Isao Kudo, Kanagawa, JP;

Akio Katsumata, Kanagawa, JP;

Yoichi Hiruta, Oita, JP;

Inventors:

Yukari Imaizumi, Kanagawa, JP;

Goshi Kawazu, Kanagawa, JP;

Isao Kudo, Kanagawa, JP;

Akio Katsumata, Kanagawa, JP;

Yoichi Hiruta, Oita, JP;

Assignee:

J-DEVICES CORPORATION, Tokyo, JP;

Attorney:

Staas & Halsey LLP

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/34 (2006.01); H01L 23/433 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/29036 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/30505 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01014 (2013.01); H01L 2224/32145 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/01047 (2013.01);
Abstract

A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.

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