The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jan. 09, 2014
International Business Machines Corporation, Armonk, NY (US);
Mark C. Lamorey, Williston, VT (US);
Janak G. Patel, South Burlington, VT (US);
Peter Slota, Jr., Vestal, NY (US);
David B. Stone, Jericho, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Packages for a three-dimensional die stack, methods for fabricating a package for a three-dimensional die stack, and methods for distributing power in a package for a three-dimensional die stack. The package may include a first lid, a second lid, a die stack located between the first lid and the second lid, a first thermal interface material layer between the first lid and a first die of the die stack, and a second thermal interface material layer between the second lid and the second die of the die stack. The second thermal interface material layer is comprised of a thermal interface material having a high electrical conductivity and a high thermal conductivity.