The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Nov. 17, 2011
Applicant:
Kimiya Miyashita, Fujisawa, JP;
Inventor:
Kimiya Miyashita, Fujisawa, JP;
Assignees:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA MATERIALS CO., LTD., Yokohamashi-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 21/04 (2006.01); H01L 23/48 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
F28F 21/04 (2013.01); H01L 23/3731 (2013.01); H01L 23/4006 (2013.01); H01L 23/433 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A ceramic heat sink material for a pressure contact structure includes a resin layer on a ceramic substrate. The resin layer can have a durometer (Shore) hardness (A-type) of 70 or less, and an average value of gaps existing in an interface between the ceramic substrate and the resin layer is 3 μm or less. The resin layer can be formed by solidifying a thermosetting resin which is fluidized at a temperature of 60° C.