The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jul. 09, 2013
Applicant:
Amkor Technology, Inc., Chandler, AZ (US);
Inventors:
Jong Dae Jung, Seoul, KR;
Dong Hyun Bang, Seoul, KR;
Yung Woo Lee, Anyang-si, KR;
EunNaRa Cho, Seoul, KR;
Byung Jun Kim, Hwaseong-si, KR;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); H01L 21/66 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01); H01L 23/055 (2006.01); H01L 23/31 (2006.01); B81B 7/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); H01L 21/565 (2013.01); H01L 24/97 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 23/055 (2013.01); H01L 23/3121 (2013.01); H01L 2224/97 (2013.01); H01L 2924/3025 (2013.01); B81B 7/0064 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0118 (2013.01); H01L 2924/1461 (2013.01);
Abstract
Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.