The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Mar. 04, 2014
Applicant:

Sandisk 3d Llc, Mitpitas, CA (US);

Inventors:

Tong Zhang, Palo Alto, CA (US);

Timothy James Minvielle, San Jose, CA (US);

Chu-Chen Fu, San Ramon, CA (US);

Wipul Jayasekara, Los Gatos, CA (US);

Assignee:

SanDisk 3D LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/16 (2006.01); H01L 47/00 (2006.01); H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1641 (2013.01); H01L 45/145 (2013.01); H01L 45/1608 (2013.01);
Abstract

A fabrication process for a resistance-switching memory cell uses metal oxide as a resistance-switching material. A metal oxide film having an initial stoichiometry is deposited on an electrode using atomic layer deposition. A changed stoichiometry is provided for a portion of the metal oxide film using a plasma reduction process, separate from the atomic layer deposition, and another electrode is formed adjacent to the changed stoichiometry portion. The film deposition and the plasma reduction can be performed in separate chambers where conditions such as temperature are optimized. The metal oxide film may be deposited on a vertical sidewall in a vertical bit linememory device. Optionally, the mean free path of hydrogen ions during the plasma reduction process is adjusted to increase the uniformity of the vertical metal oxide film. The adjustment can involve factors such as RF power, pressure and a bias of the wafer.


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