The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Jun. 04, 2009
Su-chen Lai, Hsinchu, TW;
Kong-beng Thei, Hsin-Chu County, TW;
Harry Chuang, Hsin-Chu, TW;
Gary Shen, Yonghe, TW;
Shun-jang Liao, Pingjhen, TW;
Su-Chen Lai, Hsinchu, TW;
Kong-Beng Thei, Hsin-Chu County, TW;
Harry Chuang, Hsin-Chu, TW;
Gary Shen, Yonghe, TW;
Shun-Jang Liao, Pingjhen, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method for fabricating an integrated circuit with improved uniformity among the step heights of isolation regions is disclosed. The method comprises providing a substrate having one or more trenches; filling the one or more trenches; performing a chemical mechanical polishing on the one or more filled trenches, wherein each of the one or more filled trenches comprises a thickness; measuring the thickness of each of the one or more filled trenches; determining, based on the measured thickness of each of the one or more filled trenches, an amount of time to perform an etching process; and performing the etching process for the determined amount of time.