The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Apr. 01, 2013
Applicant:
Taiwan Semiconductor Manfacturing Company, Ltd., Hsinchu, TW;
Inventors:
Kuoyuan Hsu, San Jose, CA (US);
Po-Hung Chen, Taipei, TW;
Jiann-Tseng Huang, Hsinchu, TW;
Subramani Kengeri, San Jose, CA (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/00 (2006.01); G11C 7/06 (2006.01); G11C 13/00 (2006.01); G11C 17/16 (2006.01); G11C 17/18 (2006.01); G11C 7/22 (2006.01); G11C 5/14 (2006.01); G11C 16/26 (2006.01);
U.S. Cl.
CPC ...
G11C 13/00 (2013.01); G11C 13/0004 (2013.01); G11C 5/147 (2013.01); G11C 13/004 (2013.01); G11C 7/062 (2013.01); G11C 7/00 (2013.01); G11C 16/26 (2013.01); G11C 17/16 (2013.01); G11C 17/165 (2013.01); G11C 17/18 (2013.01); G11C 2013/0045 (2013.01); G11C 7/22 (2013.01);
Abstract
In at least one embodiment, a method includes applying an input voltage external to a semiconductor chip to a first circuit of the semiconductor chip to generate an output voltage external to the semiconductor chip. The first circuit is electrically coupled to a resistive device. A logic state of the resistive device is determined based on a logic state of the external output voltage.