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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9050773 B1

PDFFull Text
Date of Patent:
Jun. 09, 2015

Filed:

Oct. 11, 2013

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Fumiteru Asai, Osaka, JP;

Goji Shiga, Osaka, JP;

Naohide Takamoto, Osaka, JP;

Assignee:

NITTO DENKO CORPORATION, Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Prashant J Khatri

Assistant Examiner:

Travis Figg

Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 27/00 (2006.01); B32B 7/02 (2006.01); B32B 27/08 (2006.01); B32B 9/00 (2006.01); B32B 33/00 (2006.01); B44C 5/08 (2006.01); B32B 7/06 (2006.01); C09J 7/02 (2006.01); C09J 201/00 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B32B 7/06 (2013.01); Y10T 428/24942 (2015.01); Y10T 428/26 (2015.01); C09J 7/02 (2013.01); C09J 201/00 (2013.01); H01L 21/68 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); H01L 2224/16225 (2013.01); H01L 21/563 (2013.01); H01L 21/6836 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/8101 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83104 (2013.01);
Abstract

The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material layer, a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer stacked in this order, and a film for semiconductor back surface stacked on the second pressure-sensitive adhesive layer of the dicing tape, in which a peel strength Y between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is larger than a peel strength X between the second pressure-sensitive adhesive layer and the film for semiconductor back surface, and in which the peel strength X is from 0.01 to 0.2 N/20 mm, and the peel strength Y is from 0.2 to 10 N/20 mm.

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