The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Jan. 27, 2012
Applicants:

Hung Chih Chen, Sunnyvale, CA (US);

Jay Gurusamy, Santa Clara, CA (US);

Gautam S. Dandavate, Sunnyvale, CA (US);

Samuel Chu-chiang Hsu, Palo Alto, CA (US);

Inventors:

Hung Chih Chen, Sunnyvale, CA (US);

Jay Gurusamy, Santa Clara, CA (US);

Gautam S. Dandavate, Sunnyvale, CA (US);

Samuel Chu-Chiang Hsu, Palo Alto, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 37/32 (2012.01); B24B 37/34 (2012.01);
U.S. Cl.
CPC ...
B24B 37/32 (2013.01); B24B 37/34 (2013.01);
Abstract

Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.


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