The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Sep. 09, 2013
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-ken, JP;

Inventor:

Daisuke Takizawa, Nagano-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 23/50 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/184 (2013.01); H01L 23/49822 (2013.01); H05K 1/185 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10636 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1531 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01);
Abstract

A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover of the electronic component. An insulator is filled between the inner wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The resin cover of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.


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