The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Mar. 22, 2011
Applicants:
Etienne Menard, Limoges, FR;
Christopher Bower, Raleigh, NC (US);
Matthew Meitl, Durham, NC (US);
Philip Garrou, Cary, NC (US);
Inventors:
Etienne Menard, Limoges, FR;
Christopher Bower, Raleigh, NC (US);
Matthew Meitl, Durham, NC (US);
Philip Garrou, Cary, NC (US);
Assignee:
Semprius, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/16 (2006.01); B23K 31/00 (2006.01); H05K 1/18 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 27/12 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/048 (2014.01); H05K 13/04 (2006.01); H01L 23/00 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/24 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); H01L 27/14618 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/056 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24998 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/3012 (2013.01); H01L 2224/32104 (2013.01); H01L 2224/32146 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80224 (2013.01); H01L 2224/821 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/83093 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83859 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83868 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12044 (2013.01); H01S 5/02236 (2013.01); H01S 5/02276 (2013.01); H01L 31/0203 (2013.01); H01L 31/048 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/014 (2013.01); H01L 2224/29101 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2224/29111 (2013.01); H05K 13/04 (2013.01); H05K 13/046 (2013.01); Y02E 10/50 (2013.01); H01L 2224/82007 (2013.01); H01L 2924/15787 (2013.01); H01L 2224/82102 (2013.01);
Abstract
An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.